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Features
* * * * * * * * * * * * * * * * * * * * *
8-bit Resolution ADC Gain Adjust 1.5 GHz Full Power Input Bandwidth (-3 dB) 1 GSPS (min) Sampling Rate SINAD = 44.3 dB (7.2 Effective Bits), SFDR = 58 dBc, at FS = 1 GSPS, FIN = 20 MHz SINAD = 42.9 dB (7.0 Effective Bits), SFDR = 52 dBc, at FS = 1 GSPS, FIN = 500 MHz SINAD = 40.3 dB (6.8 Effective Bits), SFDR = 50 dBc, at FS = 1 GSPS, FIN = 1000 MHz (-3 dB FS) 2-tone IMD: -52 dBc (489 MHz, 490 MHz) at 1 GSPS DNL = 0.3 lsb, INL = 0.7 lsb Low Bit Error Rate (10-13) at 1 GSPS Very Low Input Capacitance: 3 pF 500 mVpp Differential or Single-ended Analog Inputs Differential or Single-ended 50 ECL Compatible Clock Inputs ECL or LVDS/HSTL Output Compatibility Data Ready Output with Asynchronous Reset Gray or Binary Selectable Output Data; NRZ Output Mode Power Consumption: 3.4W at Tj = 70C Typical Radiation Tolerance Oriented Design (150 Krad (Si) measured) Two Package Versions Evaluation board: TSEV8388B Demultiplexer TS81102G0: Companion Device Available
ADC 8-bit 1 GSPS TS8388B
Applications
* * * * Digital Sampling Oscilloscopes Satellite Receiver Electronic Countermeasures/Electronic Warfare Direct RF Down-conversion
Description
The TS8388B is a monolithic 8-bit analog-to-digital converter, designed for digitizing wide bandwidth analog signals at very high sampling rates of up to 1 GSPS. The TS8388B uses an innovative architecture, including an on-chip Sample and Hold (S/H), and is fabricated with an advanced high speed bipolar process. The on-chip S/H has a 1.5 GHz full power input bandwidth, providing excellent dynamic performance in undersampling applications (High IF digitizing).
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Functional Description
Block Diagram
The following figure shows the simplified block diagram.
Figure 1. Simplified Block Diagram
GAIN
MASTER/SLAVE TRACK & HOLD AMPLIFIER VIN, VINB G=2 T/H G=1 T/H G=1 RESISTOR CHAIN ANALOG ENCODING BLOCK 4 INTERPOLATION STAGES 4 5
REGENERATION LATCHES 4 5 ERROR CORRECTION & DECODE LOGIC CLOCK BUFFER 8 OUTPUT LATCHES & BUFFERS 8 DRRB DR, DRB GORB DATA, DATAB OR, ORB
CLK, CLKB
Functional Description
The TS8388B is an 8-bit 1 GSPS ADC based on an advanced high-speed bipolar technology featuring a cutoff frequency of 25 GHz. The TS8388B includes a front-end master/slave Track and Hold stage (S/H), followed by an analog encoding stage and interpolation circuitry. Successive banks of latches regenerate the analog residues into logical data before entering an error correction circuitry and a resynchronization stage followed by 75 differential output buffers. The TS8388B works in fully differential mode from analog inputs up to digital outputs. The TS8388B features a full-power input bandwidth of 1.5 GHz. A control pin GORB is provided to select either Gray or Binary data output format. A gain control pin is provided in order to adjust the ADC gain. A Data Ready output asynchronous reset (DRRB) is available on TS8388B. The TS8388B uses only vertical isolated NPN transistors together with oxide isolated polysilicon resistors, which allow enhanced radiation tolerance (no performance drift measured at 150 kRad total dose).
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Specifications
Absolute Maximum Ratings
Table 1. Absolute Maximum Ratings
Parameter Positive supply voltage Digital negative supply voltage Digital positive supply voltage Negative supply voltage Maximum difference between negative supply voltage Analog input voltages Maximum difference between VIN and VINB Digital input voltage Digital input voltage Digital output voltage Clock input voltage Maximum difference between VCLK and VCLKB Maximum junction temperature Storage temperature Lead temperature (soldering 10s) Note: Symbol VCC DVEE VPLUSD VEE DVEE to VEE VIN or VINB VIN - VINB VD VD VO VCLK or VCLKB VCLK - VCLKB Tj Tstg Tleads GORB DRRB Comments Value GND to 6 GND to -5.7 GND -0.3 to 2.8 GND to -6 0.3 -1 to +1 -2 to +2 -0.3 to VCC +0.3 VEE -0.3 to +0.9 VPLUSD -3 to VPLUSD -0.5 -3 to +1.5 -2 to +2 +135 -65 to +150 +300 Unit V V V V V V V V V V V V C C C
Absolute maximum ratings are limiting values (referenced to GND = 0V), to be applied individually, while other parameters are within specified operating conditions. Long exposure to maximum rating may affect device reliability. The use of a thermal heat sink is mandatory. See "The board set comes fully assembled and tested, with the TS8388B installed." on page 42.
Recommended Operating Conditions
Table 2. Recommended Operating Conditions
Recommended Value Parameter Positive supply voltage Positive digital supply voltage Positive digital supply voltage Negative supply voltage Symbol VCC VPLUSD VPLUSD VEE, DVEE ECL output compatibility LVDS output compatibility Comments Min 4.5 - +1.4 -5.25 Typ +5 GND +2.4 -5 Max 5.25 - +2.6 -4.75 Unit V V V V
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Table 2. Recommended Operating Conditions (Continued)
Recommended Value Parameter Differential analog input voltage (Full Scale) Clock input power level Operating temperature range Symbol VIN, VINB VIN - VINB PCLK, PCLKB TJ Comments 50 differential or single-ended 50 single-ended clock input Commercial grade: "C" Industrial grade: "V" Military grade: "M" Min 113 450 3 Typ 125 500 4 0 < Tc; Tj < 90 -40 < Tc; Tj < 110 -55 < Tc; Tj < +125 Max 137 550 10 Unit mV mVpp dBm C
Electrical Operating Characteristics
VEE = DVEE = -5V; VCC = +5V; VIN -VINB = 500 mVpp Full Scale differential input; Digital outputs 75 or 50 differentially terminated; Tj (typical) = 70C. Full Temperature Range: up to -55C < Tc; Tj < +125C, depending on device grade.
Table 3. Electrical Specifications
Test Level Value Min Typ Max Unit Note
Parameter Power Requirements (CBGA68 package) Positive supply voltage Analog Digital (ECL) Digital (LVDS) Positive supply current Analog Digital Negative supply voltage Negative supply current Analog Digital Nominal power dissipation Power supply rejection ratio Power Requirements Power Requirements (CQFP68 packaged device) Positive supply voltage Analog Digital (ECL) Digital (LVDS)
Symbol
VCC VPLUSD VPLUSD ICC IPLUSD VEE AIEE DIEE PD PSRR
1 4 4 1 1 1 1 1 1 4
4.5 - 1.4 - - -5.5 - - - -
5 0 2.4 420 130 -5 185 160 3.9 0.5
5.5 - 2.6 445 145 -4.5 200 180 4.1 2
V V V mA mA V mA mA W mW
VCC VPLUSD VPLUSD
1, 2, 6 4 4
4.7 - 1.4
5 0 2.4
5.3 - 2.6
V V V
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Table 3. Electrical Specifications (Continued)
Test Level 1, 2 6 1, 2 6 1, 2, 6 1, 2 6 1, 2 6 1, 2 6 4 - Value Min - - - - -5.3 - - - - - - - - Typ 385 395 115 120 -5 165 170 135 145 3.4 3.6 0.5 8 Max 445 445 145 145 -4.7 200 200 180 180 4.1 4.3 2 - Unit mA mA mA mA V mA mA mA mA W W mW bits
(2)
Parameter Positive supply current Analog Digital Negative supply voltage Negative supply current Analog Digital Nominal power dissipation Power supply rejection ratio Resolution Analog Inputs Full Scale Input Voltage range (differential mode) (0V common mode voltage) Full Scale Input Voltage range (single-ended input option) (See Application Notes) Analog input capacitance Input bias current Input Resistance Full Power input Bandwidth (-3dB) CBGA68 package CQFP68 package Small signal input Bandwidth (10% full scale) Clock Inputs Logic compatibility for clock inputs (See Application Notes) ECL Clock inputs voltages (VCLK or VCLKB): Logic "0" voltage Logic "1" voltage Logic "0" current Logic "1" current Clock input power level into 50 termination Clock input power level Clock input capacitance
Symbol ICC IPLUSD VEE AIEE DIEE
Note
PD PSRR -
VIN VINB VIN VINB CIN IIN RIN FPBW - - SSBW
4 - 4 - 4 4 4 - 4 4 4
-125 -125 -250 - - - 0.5 - - - 1.5
- - - 0 3 10 1 - 1.8 1.5 1.7
125 125 250 - 3.5 20 - - - - -
mV mV mV mV pF A M - GHz GHz GHz -
- - VIL VIH IIL IIH - - CCLK
- 4 - - - - - 4 4
ECL or specified clock input power level in dBm - - -1.1 - - - - - 5 5 dBm into 50 -2 - 4 3 10 3.5 - -1.5 - 50 50
- - V V A A - dBm pF
(10)
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Table 3. Electrical Specifications (Continued)
Test Level Value Min Typ Max Unit Note
(1)(6)
Parameter
Symbol
Digital Outputs Single-ended or differential input mode, 50% clock duty cycle (CLK, CLKB), Binary output data format, Tj (typical) = 70C. Logic compatibility for digital outputs (Depending on the value of VPLUSD) (See Application Notes) Differential output voltage swings (assuming VPLUSD = 0V): 75 open transmission lines (ECL levels) 75 differentially terminated 50 differentially terminated Output levels (assuming VPLUSD = 0V) 75 open transmission lines: Logic "0" voltage Logic "1" voltage Output levels (assuming VPLUSD = 0V) 75 differentially terminated: Logic "0" voltage Logic "1" voltage Output levels (assuming VPLUSD = 0V) 50 differentially terminated: Logic "0" voltage Logic "1" voltage Differential Output Swing Output level drift with temperature - - ECL or LVDS -
- - - - - VOL VOH - VOL VOH - VOL VOH DOS -
4 - - - 4 - - 4 - - - 1, 2 6 1, 2 6 4 4
- 1.5 0.70 0.54 - - -0.88 - - -1.07 - - - -1.16 -1.25 270 -
- 1.620 0.825 0.660 - -1.62 -0.8 - -1.41 -1 - -1.40 -1.40 -1.10 -1.10 300 -
- - - - - -1.54 - - -1.34 - - -1.32 -1.25 - - - 1.6
- V V V - V V - V V - V V V V mV mV/C
(6) (6) (6)
DC Accuracy (CBGA68 package) Single-ended or differential input mode, 50% clock duty cycle (CLK, CLKB), Binary output data format Tj (typical) = 70C. Differential non linearity Differential non linearity Integral non linearity Integral non linearity No missing codes Gain Input offset voltage DNLDNL+ INLINL+ - - - 1 1 1 1 -0.6 - -1.2 - -0.4 0.4 -0.7 0.7 - 0.6 - 1.2 lsb lsb lsb lsb
(3) (2)(3) (2)(3)
Guaranteed over specified temperature range 1, 2 1, 2 90 -26 98 -5 110 26 % mV
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Table 3. Electrical Specifications (Continued)
Test Level 4 4 Value Min 100 40 Typ 125 50 Max 150 60 Unit ppm/C ppm/C Note
Parameter Gain error drift Offset error drift
Symbol - -
DC Accuracy (CQFP68 package) Single-ended or differential input mode, 50% clock duty cycle (CLK, CLKB), Binary output data format Tj (typical) = 70C. Differential non linearity Differential non linearity Integral non linearity Integral non linearity No missing code Gain error Input offset voltage Gain error drift Offset error drift Transient Performance Bit Error Rate FS = 1 GSPS FIN = 62.5 MHz ADC settling time VIN -VINB = 400 mVpp Overvoltage recovery time BER TS TOR 4 4 4 - - - - 0.5 0.5 1E-12 1 1 Error/ sample ns ns
(2)(4)
DNLDNL+ INLINL+ - - - - -
1, 2 6 1, 2 6 1, 2 6 1, 2 6
-0.5 -0.6 - - -1.0 -1.2 - -
-0.25 -0.35 0.3 0.4 0.7 0.9 0.7 0.9
- - 0.6 0.7 - - 1.0 1.2
lsb lsb lsb lsb lsb lsb lsb lsb
(2)(3)
(2)(3)
Guaranteed over specified temperature range 1, 2 6 1, 2 6 4 4 -10 -11 -26 -30 100 40 -2 -2 -5 -5 125 50 10 11 26 30 150 60 % FS % FS mV mV ppm/C ppm/C
(3)
(2)
(2)
AC Performance Single-ended or differential input and clock mode, 50% clock duty cycle (CLK, CLKB), Binary output data format, Tj = 70C, unless otherwise specified. Signal to Noise and Distortion ratio FS = 1 GSPS, FIN = 20 MHz FS = 1 GSPS, FIN = 500 MHz FS = 1 GSPS, FIN = 1000 MHz (-1 dBFs) FS = 50 MSPS, FIN = 25 MHz SINAD - 4 4 4 1, 2, 6 - 42 41 38 40 - 44 43 40 44 - - - - - - dB dB dB dB
(2)
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Table 3. Electrical Specifications (Continued)
Test Level - 4 ENOB 4 4 1, 2, 6 - 4 SNR 4 4 1, 2, 6 - 4 THD 4 4 1, 2, 6 - 4 4 SFDR 4 4 1, 2, 6 4 IMD - -47 -52 - dBc 42 45 40 - 47 50 54 - - - - - dBc dBc dBc -
(2)
Value Min - 7.0 6.6 6.2 7.0 - 42 41 41 44 - 50 46 42 46 - 52 47 Typ - 7.2 6.8 6.4 7.2 - 45 44 44 45 - 54 50 46 45 - 57 52 Max - - - - - - - - - - - - - - - - - - Unit - Bits Bits Bits Bits - dB dB dB dB - dB dB dB dB - dBc dBc
(2) (2) (2)
Parameter Effective Number Of Bits FS = 1 GSPS, FIN = 20 MHz FS = 1 GSPS, FIN = 500 MHz FS = 1 GSPS, FIN = 1000 MHz (-1 dBFs) FS = 50 MSPS, FIN = 25 MHz Signal to Noise Ratio FS = 1 GSPS, FIN = 20 MHz FS = 1 GSPS, FIN = 500 MHz FS = 1 GSPS, FIN = 1000 MHz (-1 dBFs) FS = 50 MSPS, FIN = 25 MHz Total Harmonic Distortion FS = 1 GSPS, FIN = 20 MHz FS = 1 GSPS, FIN = 500 MHz FS = 1 GSPS, FIN = 1000 MHz (-1 dBFs) FS = 50 MSPS, FIN = 25 MHz Spurious Free Dynamic Range FS = 1 GSPS, FIN = 20 MHz FS = 1 GSPS, FIN = 500 MHz FS = 1 GSPS, FIN = 1000 MHz (-1 dBFs) FS = 1 GSPS, FIN = 1000 MHz (-3 dBFs) FS = 50 MSPS, FIN = 25 MHz Two-tone Inter-modulation Distortion FIN1 = 489 MHz at FS = 1 GSPS, FIN2 = 490 MHz at FS = 1 GSPS
Symbol
Note
Switching Performance and Charcteristics - See Figure 2 and Figure 3 on page 10 Maximum clock frequency Minimum clock frequency Minimum Clock pulse width (high) Minimum Clock pulse width (low) Aperture delay Aperture uncertainty Data output delay Output rise/fall time for DATA (20% - 80%) Output rise/fall time for DATA READY (20% - 80%) FS FS TC1 TC2 Ta Jitter TDO TR/TF TR/TF - 4 4 4 4 4 4 4 4 1 10 0.280 0.350 100 - 1150 250 250 - - 0.500 0.500 +250 0.4 1360 350 350 1.4 50 50 50 400 0.6 1660 550 550 GSPS MSPS ns ns ps ps (rms) ps ps ps
(2) (2)(5) (2)(10) (11)(12) (11) (14) (15)
(11)
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Table 3. Electrical Specifications (Continued)
Test Level 4 4 4 4 4 Value Min 1110 - 0 420 Typ 1320 720 40 460 4 Max 1620 1000 80 500 Unit ps ps
(9)(13)
Parameter Data ready output delay Data ready reset delay Data to data ready - Clock low pulse width (See "Timing Diagrams" on page 10.) Data to data ready output delay (50% duty cycle) at 1 GSPS (See "Timing Diagrams" on page 10.) Data pipeline delay Notes: 1. 2. 3. 4. 5.
Symbol TDR TRDR TOD-TDR TD1 TPD
Note
(2)(10) (11)(12)
ps ps clock cycles
(14)
(2)(15)
Differential output buffers are internally loaded by 75 resistors. Buffer bias current = 11 mA. See "Definition of Terms" on page 48. Histogram testing based on sampling of a 10 MHz sinewave at 50 MSPS. Output error amplitude < 4 lsb around correct code (including gain and offset error). Maximum jitter value obtained for single-ended clock input on the JTS8388B die (chip on board): 200 fs. (500 fs expected on TS8388BG) 6. Digital output back termination options depicted in Application Notes. 7. With a typical value of TD = 465 ps, at 1 GSPS, the timing safety margin for the data storing using the ECLinPS 10E452 output registers from Motorola(R) is of 315 ps, equally shared before and after the rising edge of the Data Ready signals (DR, DRB). 8. The clock inputs may be indifferently entered in differential or single-ended, using ECL levels or 4 dBm typical power level into the 50 termination resistor of the inphase clock input. (4 dBm into 50 clock input correspond to 10 dBm power level for the clock generator.) 9. At 1 GSPS, 50/50 clock duty cycle, TC2 = 500 ps (TC1). TDR - TOD = -100 ps (typ) does not depend on the sampling rate. 10. Specified loading conditions for digital outputs: - 50 or 75 controlled impedance traces properly 50/75 terminated, or unterminated 75 controlled impedance traces. - Controlled impedance traces far end loaded by 1 standard ECLinPS register from Motorola. (i.e.: 10E452) (Typical input parasitic capacitance of 1.5 pF including package and ESD protections.) 11. Termination load parasitic capacitance derating values: - 50 or 75 controlled impedance traces properly 50/75 terminated: 60 ps/pF or 75 ps per additionnal ECLinPS load. - Unterminated (source terminated) 75 controlled impedance lines: 100 ps/pF or 150 ps per additionnal ECLinPS termination load. 12. Apply proper 50/75 impedance traces propagation time derating values: 6 ps/mm (155 ps/inch) for TSEV8388B Evaluation Board. 13. Values for TOD and TDR track each other over temperature, (1% variation for TOD-TDR per 100C temperature variation). Therefore TOD-TDR variation over temperature is negligible. Moreover, the internal (on-chip) and package skews between each Data TODs and TDR effect can be considered as negligible. Consequently, minimum values for TOD and TDR are never more than 100 ps apart. The same is true for the TOD and TDR maximum values (see Advanced Application Notes about "TOD-TDR Variation Over Temperature" on page 27). 14. Min value guarantees performance. Max value guarantees functionality. 15. Min value guarantees functionality. Max value guarantees performance.
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Timing Diagrams
Figure 2. TS8388B Timing Diagram (1 GSPS Clock Rate), Data Ready Reset, Clock Held at LOW Level
TA = 250 ps TBC
X (VIN, VINB) X N-1
N
X N+1
TC = 1000 ps TC1 TC2
X N+2
X N+3
X N+4
X N+5
(CLK, CLKB)
1360 ps TPD: 4.0 Clock periods TOD = 1360 ps
DIGITAL OUTPUTS
1000 ps
DATA N-5
DATA N-4
TDR = 1320 ps
DATA N-3
DATA N-2
DATA N-1
DATA N
N+1
TDR = 1320 ps
TD1 = TC1+TDR-TOD = TC1-40 ps = 460 ps
Data Ready (DR, DRB)
TD2 = TC2+TOD-TDR = TC2+40 ps = 540 ps
TRDR = 720 ps
DRRB
1 ns (min)
Figure 3. TS8388B Timing Diagram (1 GSPS Clock Rate), Data Ready Reset, Clock Held at HIGH Level
TA = 250 ps TBC
X
(VIN, VINB)
X
X
N+2
X
N+4
X
X
N+5
XN-1
N
N+1
TC = 1000 ps TC1 TC2
(CLK, CLKB)
1360 ps TPD: 4.0 Clock periods TOD = 1360 ps
DIGITAL OUTPUTS
1000 ps
DATA N-5
DATA N-4
TDR = 1320 ps
DATA N-3
DATA N-2
DATA N-1
DATA N
DATA N+1
TDR = 1320 ps
TD1 = TC1+TDR-TOD = TC1-40 ps = 460 ps
Data Ready (DR, DRB)
TD2 = TC2+TOD-TDR = TC2+40 ps = 540 ps
TRDR = 720 ps
DRRB
1 ns (min)
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Explanation of Test Levels
Table 4. Explanation of Test Levels
Num 1 2 3 4 5 6 Notes: Characteristics 100% production tested at +25C(1) (for "C" Temperature range(2)). 100% production tested at +25C(1), and sample tested at specified temperatures (for "V" and "M" Temperature range(2)). Sample tested only at specified temperatures. Parameter is guaranteed by design and characterization testing (thermal steady-state conditions at specified temperature). Parameter is a typical value only. 100% production tested over specified temperature range (for "B/Q" Temperature range(2)). 1. Unless otherwise specified, all tests are pulsed tests: therefore Tj = Tc = Ta, where Tj, Tc and Ta are junction, case and ambient temperature respectively. 2. Refer to "Ordering Information" on page 50. 3. Only MIN and MAX values are guaranteed (typical values are issuing from characterization results).
Functions Description
Table 5. Functions Description
Name VCC VEE VPLUSD GND VIN, VINB CLK, CLKB DR, DRB OR, ORB GAIN GORB DIOD/DRRB Function Positive power supply Analog negative power supply
VCC = +5V VPLUSD = +0V (ECL) VPLUSD = +2.4V (LVDS)
Digital positive power supply Ground Differential analog inputs Differential clock inputs Differential output data port Differential data ready outputs Out of range outputs ADC gain adjust Gray or Binary digital output select Die junction temperature measurement/ asynchronous data ready reset
DVEE = -5V VEE = -5V GND VIN VINB CLK CLKB GAIN GORG DIOD/ DRRB TS8388B
16
OR ORB D0 D0B DR DRB D7 D7B
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Digital Output Coding
NRZ (Non Return to Zero) mode, ideal coding: does not include gain, offset, and linearity voltage errors.
Table 6. Digital Output Coding
Digital Output Differential Analog Input > +251 mV +251 mV +249 mV +126 mV +124 mV +1 mV -1 mV -124 mV -126 mV -249 mV -251 mV < -251 mV Voltage Level > Positive full scale + 1/2 lsb Positive full scale + 1/2 lsb Positive full scale - 1/2 lsb Positive 1/2 scale + 1/2 lsb Positive 1/2 scale - 1/2 lsb Bipolar zero + 1/2 lsb Bipolar zero - 1/2 lsb Negative 1/2 scale + 1/2 lsb Negative 1/2 scale - 1/2 lsb Negative full scale + 1/2 lsb Negative full scale - 1/2 lsb < Negative full scale - 1/2 lsb Binary GORB = VCC or Floating 11111111 11111111 11111110 11000000 10111111 10000000 01111111 01000000 00111111 00000001 00000000 00000000 Gray GORB = GND 10000000 10000000 10000001 10100000 11100000 11000000 01000000 01100000 00100000 00000001 00000000 00000000 Out of Range 1 0 0 0 0 0 0 0 0 0 0 1
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Package Description
Pin Description
Table 7. TS8388BGL Pin Description (CBGA68 package)
Symbol GND VCC VEE DVEE VIN VINB CLK CLKB B0, B1, B2, B3, B4, B5, B6, B7 B0B, B1B, B2B, B3B, B4B, B5B, B6B, B7B OR ORB DR DRB GORB Pin number A2, A5, B1, B5, B10, C2, D2, E1, E2, E11, F1, F2, G11, K2, K3, K4, K5, K10, L2, L5 A4, A6, B2, B4, B6, H1, H2, L6, L7 A3, B3, G1, G2, J1, J2 F10, F11 L3 L4 C1 D1 A8, A9, A10, D10, H11, J11, K9, K8 B7, B8, B9, C11, G10, H10, L10, L9 K7 L8 E10 D11 A7 Function Ground pins. To be connected to external ground plane. +5V positive supply. 5V analog negative supply. -5V digital negative supply. In phase (+) analog input signal of the Sample and Hold differential preamplifier. Inverted phase (-) of ECL clock input signal (CLK). In phase (+) ECL clock input signal. The analog input is sampled and held on the rising edge of the CLK signal. Inverted phase (-) of ECL clock input signal (CLK). In phase (+) digital outputs. B0 is the LSB. B7 is the MSB. Inverted phase (-) digital outputs. B0B is the inverted LSB. B7B is the inverted MSB. In phase (+) Out of Range Bit. Out of Range is high on the leading edge of code 0 and code 256. Inverted phase (+) Out of Range Bit (OR). In phase (+) output of Data Ready Signal. Inverted phase (-) output of Data Ready Signal (DR). Gray or Binary select output format control pin. - Binary output format if GORB is floating or VCC. - Gray output format if GORB is connected at ground (0V). ADC gain adjust pin. The gain pin is by default grounded, the ADC gain transfer fuction is nominally close to one. Die function temperature measurement pin and asynchronous data ready reset active low, single-ended ECL input. +2.4V for LVDS output levels otherwise to GND(2). Not connected.
GAIN DIOD/DRRB
K6 K1
VPLUSD NC Note:
B11, C10, J10, K11 A1, A11, L1, L11
1. The common mode level of the output buffers is 1.2V below the positive digital supply. For ECL compatibility the positive digital supply must be set at 0V (ground). For LVDS compatibility (output common mode at +1.2V) the positive digital supply must be set at 2.4V. If the subsequent LVDS circuitry can withstand a lower level for input common mode, it is recommended to lower the positive digital supply level in the same proportion in order to spare power dissipation.
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TS8388BGL Pinout
Figure 4. TS8388BGL Pinout of CBGA 68 Package
11
NC
VPLUSD
B3b
DRb
GND
DVEE
GND
B4
B5
VPLUSD
NC
10
B2
GND
VPLUSD
B3
DR
DVEE
B4b
B5b
VPLUSD
GND
B6b
9
B1
B2b
B6
B7b
8
B0
B1b
B7
ORb
7
Gorb
B0b
OR
VCC
6
VCC
VCC
GAIN
VCC
5
GND
GND
GND
GND
4
VCC
VCC
GND
VINB
3
VEE
VEE
GND
VIN
2
GND
VCC
GND
GND
GND
GND
VEE
VCC
VEE
GND
GND
1 Ball A1 Index other side
NC
GND
CLK
CLKB
GND
GND
VEE
VCC
VEE
Diode
NC
A
B
C
D
E
F
G
H
J
K
L
BOTTOM VIEW
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Table 8. TS8388BF/TS8388BFS Pin Description (CQFP68 package)
Symbol GND VPLUSD VCC VEE DVEE VIN VINB CLK CLKB D0, D1, D2, D3, D4, D5, D6, D7 D0B, D1B, D2B, D3B, D4B, D5B, D6B, D7B OR ORB DR DRB GORB Pin number 5, 13, 27, 28, 34, 35, 36, 41, 42, 43, 50, 51, 52, 53, 58, 59 1, 2, 16, 17, 18, 68 26, 29, 32, 33, 46, 47, 61 30, 31, 44, 45, 48 8, 9, 10 54(1), 55 56, 57(1) 37(1), 38 39, 40(1) 23, 21, 19, 14, 6, 3, 66, 64 24, 22, 20, 15, 7, 4, 67, 65 62 63 11 12 25 Function Ground pins. To be connected to external ground plane. Digital positive supply (0V for ECL compatibility, 2.4V for LVDS compatibility).(2) +5V positive supply. -5V analog negative supply. -5V digital negative supply. In phase (+) analog input signal of the Sample and Hold differential preamplifier. Inverted phase (-) of analog input signal (VIN). In phase (+) ECL clock input signal. The analog input is sampled and held on the rising edge of the CLK signal. Inverted phase (-) of ECL clock input signal (CLK). In phase (+) digital outputs. B0 is the LSB. B7 is the MSB. Inverted phase (-) digital outputs. B0B is the inverted LSB. B7B is the inverted MSB. In phase (+) Out of Range Bit. Out of Range is high on the leading edge of code 0 and code 256. Inverted phase (+) Out of Range Bit (OR). In phase (+) output of Data Ready Signal. Inverted phase (-) output of Data Ready Signal (DR). Gray or Binary select output format control pin. - Binary output format if GORB is floating or VCC. - Gray output format if GORB is connected at ground (0V). ADC gain adjust pin. This pin has a double function (can be left open or grounded if not used): - DIOD: die junction temperature monitoring pin. - DRRB: asynchronous data ready reset function.
GAIN DIOD/DRRB
60 49
Notes:
1. Following pin numbers 37 (CLK), 40 (CLKB), 54 (VIN) and 57 (VINB) have to be connected to GND through a 50 resistor as close as possible to the package (50 termination preferred option). 2. The common mode level of the output buffers is 1.2V below the positive digital supply. For ECL compatibility the positive digital supply must be set at 0V (ground). For LVDS compatibility (output common mode at +1.2V) the positive digital supply must be set at 2.4V. If the subsequent LVDS circuitry can withstand a lower level for input common mode, it is recommended to lower the positive digital supply level in the same proportion in order to spare power dissipation.
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TS8388BF/ TS8388BFS Pinout
Figure 5. TS8388BF/TS8388BFS Pinout of CQFP68 package
TOP VIEW 17 16 15 14 13 12 11 10 VPLUSD VPLUSD DVEE GND DRB D3B 9 DVEE 8 DVEE 7 D4B 6 5 GND 4 D5B 3 2 VPLUSD 1 VPLUSD
DR
D3
D4
D5
Pin 1 index
18 VPLUSD 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 D2 D2B D1 D1B D0 D0B GORB VCC GND GND VCC VEE VEE VCC VCC GND TS8388BF/TS8388BFS
VPLUSD 68 D6B D6 D7B D7 ORB OR VCC Gain GND GND VINb VINb VIN VIN GND GND 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52
Diode
GND
GND
GND
VEE
VCC
CLKb
VCC
VEE
CLK
GND
CLKb
GND
35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51
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GND
GND
CLK
VEE
TS8388B
Typical Characterization Results
Static Linearity
FS = 50 MSPS/FIN = 10 MHz Figure 6. Integral Non Linearity
Note:
Clock Frequency = 50 MSPS; Signal Frequency = 10 MHz; Positive peak: 0.78 lsb; Negative peak: -0.73 lsb
Figure 7. Differential Non Linearity
Note:
Clock Frequency = 50 MSPS; Signal Frequency = 10 MHz; Positive peak: 0.3 lsb; Negative peak: -0.39 lsb
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Effective Number of Bits Versus Power Supplies Variation
Figure 8. Effective Number of Bits = f (VEEA); FS = 500 MSPS; FIN = 100 MHz
8 7 6 ENOB (bits) 5 4 3 2 1 0 -7 -6.5 -6 -5.5 VEEA (V) -5 -4.5 -4
Figure 9. Effective Number of Bits = f (VCC); FS = 500 MSPS; FIN = 100 MHz
8 7 6 ENOB (bits) 5 4 3 2 1 0 3 3.5 4 4.5 5 VCC (V) 5.5 6 6.5 7
Figure 10. Effective Number of Bits = f (VEED); FS = 500 MSPS; FIN = 100 MHz
8 7 6 ENOB (bits) 5 4 3 2 1 0 -6 -5.5 -5 -4.5 VEED (V) -4 -3.5 -3
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Typical FFT Results
Figure 11. FS = 1 GSPS; FIN = 20 MHz
Figure 12. FS = 1 GSPS; FIN = 495 MHz
Figure 13. FS = 1 GSPS; FIN = 995 MHz (-3 dB Full Scale Input)
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Spurious Free Dynamic Range Versus Input Amplitude
Figure 14. Sampling Frequency: FS = 1 GSPS; Input Frequency FIN = 995 MHz; Full Scale; ENOB = 6.4; SINAD = 40 dB; SNR = 44 dB; THD = -46 dBc; SFDR = -47 dBc; Gray or Binary Output Coding
Figure 15. Sampling Frequency: FS = 1 GSPS; Input Frequency FIN = 995 MHz; -3 dB Full Scale; ENOB = 6.6; SINAD = 40.8 dB; SNR = 44 dB; THD = -48 dBc; SFDR = -50 dBc; Gray or Binary Output Coding
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Dynamic Performance Versus Analog Input Frequency
Figure 16. ENOB (dB)
8
FS = 1 GSPS, FIN = 0 up to 1600 MHz, Full Scale input (FS), FS -3 dB Clock duty cycle 50/50, Binary/Gray output coding, fully differential or single-ended analog and clock inputs.
7 ENOB (dB) -3 dB FS
6
5
FS
4
3
0
200
400
600
800
1000
1200
1400
1600
1800
Input frequency (MHz)
Figure 17. SNR (dB)
50 48 46 44 SNR (dB) 42 40 38 36 34 32 30 0 200 400 600 800 1000 Input frequency (MHz) 1200 1400 1600 1800 FS -3 dB FS
Figure 18. SFDR (dBc)
-20 -25 -30 SFDR (dBc) -35 -40 -45 -50 -55 -60 0 200 400 600 800 1000 1200 1400 1600 1800 Input frequency (MHz) -3 dB FS FS
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Effective Number of Bits (ENOB) Versus Sampling Frequency
Figure 19. ENOB (dB)
8
Analog Input Frequency: FIN = 495 MHz and Nyquist conditions (FIN = FS/2) Clock duty cycle 50/50, Binary output coding
FIN = FS/2 7 FIN = 500 MHz 6 ENOB (dB)
5
4
3
2 0 200 400 600 800 1000 1200 1400 1600 Sampling frequency (MSPS)
SFDR Versus Sampling Frequency
Figure 20. SFDR (dBc)
-20 -25 -30 -35 SFDR (dBc) -40 -45
Analog Input Frequency: FIN = 495 MHz and Nyquist conditions (FIN = FS/2) Clock duty cycle 50/50, Binary output coding
FIN = FS/2 -50 FIN = 500 MHz -55 -60 0 200 400 600 800 1000 1200 1400 1600 Sampling frequency (MSPS)
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TS8388B ADC Performances Versus Junction Temperature
Figure 21. Effective Number of Bits Versus Junction Temperature FS = 1 GSPS; FIN = 500 MHz; Duty Cycle = 50%
8 7 ENOB (bits) 6 5 4 3 -40
-20
0
20
40 60 80 Temperature (C)
100
120
140
160
Figure 22. Signal to Noise Ratio Versus Junction Temperature FS = 1 GSPS; FIN = 507 MHz; Differential Clock; Single-ended Analog Input (VIN = -1 dBFs)
46
45 SNR (dB)
44
43
42 -60 -40 -20 0 20 40 Temperature (C) 60 80 100 120
Figure 23. Total Harmonic Distorsion Versus Junction Temperature FS = 1 GSPS; FIN = 507 MHz; Differential Clock; Single-ended Analog Input (VIN = -1 dBFs)
53 51 THD (dB) 49 47 45 43 -60
-40
-20
0
20 40 Temperature (C)
60
80
100
120
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Figure 24. Power Consumption Versus Junction Temperature FS = 1 GSPS; FIN = 500 MHz; Duty Cycle = 50%
5
Power consumption (W)
4
3
2
1
0 -40 -20 0 20 40 60 80 100 120 140 160
Temperature (C)
Typical Full Power Input Bandwidth
Figure 25. 1.8 GHz at -3 dB (-2 dBm Full Power Input) - CBGA68 package
Frequency (MHz) 400 0 600 800 1000 1200 1400 1600 1800 2000
-1
Magnitude (dB)
-2
-3
-4
-5
-6
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TS8388B
Figure 26. 1.5 GHz at -3 dB (-2 dBm Full Power Input) - CQFP68 package
Frequency (MHz) 100 0 300 500 700 900 1100 1300 1500 1700
-1
-2 Magnitude (dB)
-3
-4
-5
-6
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ADC Step Response
Test pulse input characteristics: 20% to 80% input full scale and rise time ~ 200 ps.
Note: This step response was obtained with the TSEV8388B chip on-board (device in die form).
Figure 27. Test Pulse Digitized with 20 GHz DSO
Vpp ~ 260 mV Tr ~ 240 ps 50 mV/div 500 ps/div
0
0.5
1.0
1.5
2.0
2.5 Time (ns)
3.0
3.5
4.0
4.5
5.0
Figure 28. Same Test Pulse Digitized with TS8388B ADC
200
150
ADC code
Tr ~ 280 ps 100 50 codes/div (Vpp ~ 260 mV) 500 ps/div
ADC calculated rise time: between 150 and 200 ps 50
0 0 0.5 1.0 1.5 2.0 2.5 Time (ns) 3.0 3.5 4.0 4.5 5.0
Note:
Ripples are due to the test setup (they are present on both measurements).
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TS8388B
TS8388B Main Features
Timing Information
Timing Value for TS8388B Timing values as defined in Table 3 on page 4 are advanced data, issued from electric simulations and first characterizations results fitted with measurements. Timing values are given at package inputs/outputs, taking into account package internal controlled impedance traces propagation delays, gullwing pin model, and specified termination loads. Propagation delays in 50/75 impedance traces are NOT taken into account for TOD and TDR. Apply proper derating values corresponding to termination topology. The min/max timing values are valid over the full temperature range in the following conditions: * Specified Termination Load (Differential output Data and Data Ready): 50 resistor in parallel with 1 standard ECLinPS register from Motorola (i.e.: 10E452) Typical ECLinPS inputs shows a typical input capacitance of 1.5 pF (including package and ESD protections). If addressing an output Dmux, take care if some Digital outputs do not have the same termination load and apply corresponding derating value given below. Output Termination Load derating values for TOD and TDR: ~ 35 ps/pF or 50 ps per additional ECLinPS load. Propagation time delay derating values have also to be applied for TOD and TDR: ~ 6 ps/mm (155 ps/inch) for TSEV8388B Evaluation Board. Apply proper time delay derating value if a different dielectric layer is used.
* *
Propagation Time Considerations
TOD and TDR Timing values are given from pin to pin and DO NOT include the additional propagation times between device pins and input/output termination loads. For the TSEV8388B Evaluation Board, the propagation time delay is 6 ps/mm (155 ps/inch) corresponding to 3.4 (at 10 GHz) dielectric constant of the RO4003 used for the Board. If a different dielectric layer is used (for instance Teflon), please use appropriate propagation time values. TD does NOT depend on propagation times because it is a differential data (TD is the time difference between Data Ready output delay and digital Data output delay). TD is also the most straightforward data to measure, again because it is differential: TD can be measured directly onto termination loads, with matched Oscilloscopes probes.
TOD-TDR Variation Over Temperature
Values for TOD and TDR track each other over temperature (1% variation for TOD-TDR per 100C temperature variation). Therefore TOD-TDR variation over temperature is negligible. Moreover, the internal (on-chip) and package skews between each Data TODs and TDR effect can be considered as negligible.
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Consequently, minimum values for TOD and TDR are never more than 100 ps apart. The same is true for the TOD and TDR maximum values. In other terms : - - If TOD is at 1150 ps, TDR will not be at 1620 ps (maximum time delay for TDR). If TOD is at 1660 ps, TDR will not be at 1110 ps (minimum time delay for TDR). However, external TOD-TDR values may be dictated by total digital datas skews between every TODs (each digital data) and TDR: MCM Board, bonding wires and output lines lengths differences, and output termination impedance mismatches.
The external (on board) skew effect has NOT been taken into account for the specification of the minimum and maximum values for TOD-TDR.
Principle of Operation
The Analog input is sampled on the rising edge of external clock input (CLK, CLKB) after TA (aperture delay) of typically 250 ps. The digitized data is available after 4 clock periods latency (pipeline delay (TPD)), on clock rising edge, after 1360 ps typical propagation delay TOD. The Data Ready differential output signal frequency (DR, DRB) is half the external clock frequency, that is it switches at the same rate as the digital outputs. The Data Ready output signal (DR, DRB) switches on external clock falling edge after a propagation delay TDR of typically 1320 ps. A Master Asynchronous Reset input command DRRB (ECL compatible single-ended input) is available for initializing the differential Data Ready output signal (DR, DRB). This feature is mandatory in certain applications using interleaved ADCs or using a single ADC with demultiplexed outputs. Actually, without Data Ready signal initialization, it is impossible to store the output digital datas in a defined order.
Principle of Data Ready Signal Control by DRRB Input Command
Data Ready Output Signal Reset The Data Ready signal is reset on falling edge of DRRB input command, on ECL logical low level (-1.8V). DRRB may also be tied to VEE = -5V for Data Ready output signal Master Reset. So long DRRB remains at logical low level, (or tied to VEE = -5V), the Data Ready output remains at logical zero and is independant of the external free running encoding clock. The Data Ready output signal (DR, DRB) is reset to logical zero after TRDR = 920 ps typical. TRDR is measured between the -1.3V point of the falling edge of DRRB input command and the zero crossing point of the differential Data Ready output signal (DR, DRB). The Data Ready Reset command may be a pulse of 1 ns minimum time width.
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TS8388B
Data Ready Output Signal Restart The Data Ready output signal restarts on DRRB command rising edge, ECL logical high levels (-0.8V). DRRB may also be Grounded, or is allowed to float, for normal free running Data Ready output signal. The Data Ready signal restart sequence depends on the logical level of the external encoding clock, at DRRB rising edge instant: * The DRRB rising edge occurs when external encoding clock input (CLK, CLKB) is LOW: The Data Ready output first rising edge occurs after half a clock period on the clock falling edge, after a delay time TDR = 1320 ps already defined hereabove. The DRRB rising edge occurs when external encoding clock input (CLK, CLKB) is HIGH: The Data Ready output first rising edge occurs after one clock period on the clock falling edge, and a delay TDR = 1320 ps.
*
Consequently, as the analog input is sampled on clock rising edge, the first digitized data corresponding to the first acquisition (N) after Data Ready signal restart (rising edge) is always strobed by the third rising edge of the data ready signal. The time delay (TD1) is specified between the last point of a change in the differential output data (zero crossing point) to the rising or falling edge of the differential Data Ready signal (DR, DRB) (zero crossing point). For normal initialization of Data Ready output signal, the external encoding clock signal frequency and level must be controlled. It is reminded that the minimum encoding clock sampling rate for the ADC is 10 MSPS and consequently the clock cannot be stopped. One single pin is used for both DRRB input command and die junction temperature monitoring. Pin denomination will be DRRB/DIOD. On the former version denomination was DIOD. Temperature monitoring and Data Ready control by DRRB is not possible simultaneously.
Analog Inputs (VIN) (VINB)
The analog input Full Scale range is 0.5V peak to peak (Vpp), or -2 dBm into the 50 termination resistor. In differential mode input configuration, that means 0.25V on each input, or 125 mV around 0V. The input common mode is GROUND. The typical input capacitance is 3 pF for TS8388B in CQFP and CBGA packages. The input capacitance is mainly due to the package. The ESD protections are not connected (but present) on the inputs.
Differential Inputs Voltage Span
Figure 29. Differential Inputs Voltage Span
[mV] 125 500 mV Full Scale analog input 250 mV VIN VINB
-250 mV
0V
-125 (VIN, VINB) = 250 mV = 500 mV diff
t
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Differential Versus Single-ended Analog Input Operation
The TS8388B can operate at full speed in either differential or single-ended configuration. This is explained by the fact the ADC uses a high input impedance differential preamplifier stage, (preceeding the Sample and hold stage), which has been designed in order to be entered either in differential mode or single-ended mode. This is true so long as the out-of-phase analog input pin VINB is 50 terminated very closely to one of the neighboring shield ground pins (52, 53, 58, 59) which constitute the local ground reference for the inphase analog input pin (VIN). Thus the differential analog input preamplifier will fully reject the local ground noise (and any capacitively and inductively coupled noise) as common mode effects. In typical single-ended configuration, enter on the (VIN) input pin, with the inverted phase input pin (VINB) grounded through the 50 termination resistor. In single-ended input configuration, the in-phase input amplitude is 0.5V peak to peak, centered on 0V (or -2 dBm into 50). The inverted phase input is at ground potential through a 50 termination resistor. However, dynamic performances can be somewhat improved by entering either analog or clock inputs in differential mode.
Typical Single-ended Analog Input Configuration Figure 30. Typical Single-ended Analog Input Configuration
[mV] 250 500 mV Full Scale analog input 500 mV VINB t VIN = 250 mV = 500 mV diff 50 reverse termination VIN VIN or VINB double pad (pins 54, 55 or 56, 57) VIN or VINB
VINB = 0V
50 (external or on package)
1 M
3 pF
-250
Note:
Since VIN and VINB have a double pad architecture, a 50 reverse termination is needed. For the CBGA package, this reverse termination is already on package.
Clock Inputs (CLK) (CLKB)
The TS8388B can be clocked at full speed without noticeable performance degradation in either differential or single-ended configuration. This is explained by the fact the ADC uses a differential preamplifier stage for the clock buffer, which has been designed in order to be entered either in differential or single-ended mode. Recommended sinewave generator characteristics are typically -120 dBc/Hz phase noise floor spectral density, at 1 kHz from carrier, assuming a single tone 4 dBm input for the clock signal.
Single-ended Clock Input (Ground Common Mode)
Although the clock inputs were intended to be driven differentially with nominal -0.8V/-1.8V ECL levels, the TS8388B clock buffer can manage a single-ended sinewave clock signal centered around 0V. This is the most convenient clock input configuration as it does not require the use of a power splitter.
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TS8388B
No performance degradation (i.e.: due to timing jitter) is observed in this particular singleended configuration up to 1.2 GSPS Nyquist conditions (FIN = 600 MHz). This is true so long as the inverted phase clock input pin is 50 terminated very closely to one of the neighboring shield ground pins, which constitutes the local Ground reference for the inphase clock input. Thus the TS8388B differential clock input buffer will fully reject the local ground noise (and any capacitively and inductively coupled noise) as common mode effects. Moreover, a very low phase noise sinewave generator must be used for enhanced jitter performance. The typical inphase clock input amplitude is 1V peak to peak, centered on 0V (ground) common mode. This corresponds to a typical clock input power level of 4 dBm into the 50 termination resistor. Do not exceed 10 dBm to avoid saturation of the preamplifier input transistors. The inverted phase clock input is grounded through the 50 termination resistor. Figure 31. Single-ended Clock Input (Ground common mode): VCLK Common Mode = 0V; VCLKB = 0V; 4 dBm Typical Clock Input Power Level (into 50 termination resistor)
[V] +0.5V VCLK CLK or CLKB double pad (pins 37, 38 or 39, 40) CLK or CLKB 1 M
VCLK = 0V VCLK -0.5V t
50 (external or on package)
0.4 pF
50 reverse termination
Note:
Do not exceed 10 dBm into the 50 termination resistor for single clock input power level.
Differential ECL Clock Input
The clock inputs can be driven differentially with nominal -0.8V/-1.8V ECL levels. In this mode, a low phase noise sinewave generator can be used to drive the clock inputs, followed by a power splitter (hybrid junction) in order to obtain 180 degrees out of phase sinewave signals. Biasing tees can be used for offseting the common mode voltage to ECL levels. Note: As the biasing tees propagation times are not matching, a tunable delay line is required in order to ensure the signals to be 180 degrees out of phase especially at fast clock rates in the GSPS range.
Figure 32. Differential Clock Inputs (ECL Levels)
[mV] -0.8V VCLK VCLKB CLK or CLKB double pad (pins 37, 38 or 39, 40) CLK or CLKB 1 M
Common mode = -1.3V
50 (external or on package)
0.4 pF
-2V 50 reverse termination
-1.8V
t
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Single-ended ECL Clock Input
In single-ended configuration enter on CLK (resp. CLKB) pin, with the inverted phase Clock input pin CLKB (respectively CLK) connected to -1.3V through the 50 termination resistor. The inphase input amplitude is 1V peak to peak, centered on -1.3V common mode. Figure 33. Single-ended Clocl Input (ECL): VCLK Common Mode = -1.3V; VCLKB = -1.3V
[V] -0.8V VCLK
VCLKB = -1.3V
-1.8V
t
Noise Immunity Information
Circuit noise immunity performance begins at design level. Efforts have been made on the design in order to make the device as insensitive as possible to chip environment perturbations resulting from the circuit itself or induced by external circuitry (Cascode stages isolation, internal damping resistors, clamps, internal (on-chip) decoupling capacitors). Furthermore, the fully differential operation from analog input up to the digital outputs provides enhanced noise immunity by common mode noise rejection. Common mode noise voltage induced on the differential analog and clock inputs will be canceled out by these balanced differential amplifiers. Moreover, proper active signals shielding has been provided on the chip to reduce the amount of coupled noise on the active inputs. The analog inputs and clock inputs of the TS8388B device have been surrounded by ground pins, which must be directly connected to the external ground plane.
Digital Outputs
The TS8388B differential output buffers are internally 75 loaded. The 75 resistors are connected to the digital ground pins through a -0.8V level shift diode (see Figure 34, Figure 35, Figure 36 on page 35). The TS8388B output buffers are designed for driving 75 (default) or 50 properly terminated impedance lines or coaxial cables. An 11 mA bias current flowing alternately into one of the 75 resistors when switching ensures a 0.825V voltage drop across the resistor (unterminated outputs). The VPLUSD positive supply voltage allows the adjustment of the output common mode level from -1.2V (VPLUSD = 0V for ECL output compatibility) to +1.2V (VPLUSD = 2.4V for LVDS output compatibility). Therefore, the single-ended output voltages vary approximately between -0.8V and -1.625V, (outputs unterminated), around -1.2V common mode voltage.
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TS8388B
Three possible line driving and back-termination scenarios are proposed (assuming VPLUSD = 0V): 1. 75 impedance transmission lines, 75 differentially terminated (Figure 34): Each output voltage varies between -1V and -1.42V (respectively +1.4V and +1V), leading to 0.41V = 0.825V in differential, around -1.21V (respectively +1.21V) common mode for VPLUSD = 0V (respectively 2.4V). 2. 50 impedance transmission lines, 50 differentially termination (Figure 35): Each output voltage varies between -1.02V and -1.35V (respectively +1.38V and +1.05V), leading to 0.33V = 660 mV in differential, around -1.18V (respectively +1.21V) common mode for VPLUSD = 0V (respectively 2.4V). 3. 75 impedance open transmission lines (Figure 36): Each output voltage varies between -1.6V and -0.8V (respectively +0.8V and +1.6V), which are true ECL levels, leading to 0.8V = 1.6V in differential, around -1.2V (respectively +1.2V) common mode for VPLUSD = 0V (respectively 2.4V). Therefore, it is possible to drive directly high input impedance storing registers, without terminating the 75 transmission lines. In time domain, that means that the incident wave will reflect at the 75 transmission line output and travel back to the generator (i.e.: the 75 data output buffer). As the buffer output impedance is 75, no back reflection will occur.
Note: This is no longer true if a 50 transmission line is used, as the latter is not matching the buffer 75 output impedance.
Each differential output termination length must be kept identical. It is recommended to decouple the midpoint of the differential termination with a 10 nF capacitor to avoid common mode perturbation in case of slight mismatch in the differential output line lengths. Too large mismatches (keep < a few mm) in the differential line lengths will lead to switching currents flowing into the decoupling capacitor leading to switching ground noise. The differential output voltage levels (75 or 50 termination) are not ECL standard voltage levels, however it is possible to drive standard logic ECL circuitry like the ECLinPS logic line from Motorola(R). At sampling rates exceeding 1 GSPS, it may be difficult to trigger any Acquisition System with digital outputs. It becomes necessary to regenerate digital data and Data Ready by means of external amplifiers, in order to be able to test the TS8388B at its optimum performance conditions.
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Differential Output Loading Configurations (Levels for ECL Compatibility) Figure 34. Differential Output: 75 Terminated
VPLUSD = 0V -0.8V Out 75 75 75 75 -1V/-1.41V
Differential output: +0.41V = 0.825V Common mode level: -1.2V (-1.2V below VPLUSD level)
-
+
75 impedance
10 nF
75
OutB 11 mA DVEE
-1.41V/-1V
Figure 35. Differential Output: 50 Terminated
VPLUSD = 0V -0.8V Out 75 75 50 50 -1.02V/-1.35V
Differential output: +0.33V = 0.660V Common mode level: -1.2V (-1.2V below VPLUSD level)
-
+
50 impedance
10 nF
50
OutB 11 mA DVEE
-1.35V/-1.02V
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Figure 36. Differential Output: Open Loaded
VPLUSD = 0V -0.8V Out 75 75 75 -0.8V/-1.6V
Differential output: +0.8V = 1.6V Common mode level: -1.2V (-1.2V below VPLUSD level)
-
+
75 impedance
OutB 11 mA DVEE
-1.6V/-0.8V
Differential Output Loading Configurations (Levels for LVDS Compatibility) Figure 37. Differential Output: 75 Terminated
VPLUSD = 2.4V 1.6V Out 75 75 75 75 1.4V/0.99V
Differential output: +0.41V = 0.825V Common mode level: -1.2V (-1.2V below VPLUSD level)
-
+
75 impedance
10 nF
75
OutB 11 mA DVEE
0.99V/1.4V
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Figure 38. Differential Output: 50 Terminated
VPLUSD = 2.4V 1.6V Out 75 75 50 50 1.38V/1.05V
Differential output: +0.33V = 0.660V Common mode level: -1.2V (-1.2V below VPLUSD level)
-
+
50 impedance
10 nF
50
OutB 11 mA DVEE
1.05V/1.38V
Figure 39. Differential Output: Open Loaded
VPLUSD = 2.4V 1.6V Out 75 75 75 1.6V/0.8V
Differential output: +0.8V = 1.6V Common mode level: -1.2V (-1.2V below VPLUSD level)
-
+
75 impedance
OutB 11 mA DVEE
0.8V/1.6V
Out of Range Bit
An Out of Range (OR, ORB) bit is provided that goes to logical high state when the input exceeds the positive full scale or falls below the negative full scale. When the analog input exceeds the positive full scale, the digital output datas remain at high logical state, with (OR, ORB) at logical one. When the analog input falls below the negative full scale, the digital outputs remain at logical low state, with (OR, ORB) at logical one again.
Gray or Binary Output Data Format Select
The TS8388B internal regeneration latches indecision (for inputs very close to latches threshold) may produce errors in the logic encoding circuitry and leading to large amplitude output errors. This is due to the fact that the latches are regenerating the internal analog residues into logical states with a finite voltage gain value (Av) within a given positive amount of time (t): Av = exp((t)/), with the positive feedback regeneration time constant. The TS8388B has been designed for reducing the probability of occurrence of such errors to approximately 10-13 (targeted for the TS8388B at 1 GSPS).
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TS8388B
A standard technique for reducing the amplitude of such errors down to 1 lsb consists of outputting the digital datas in Gray code format. Though the TS8388B has been designed for featuring a Bit Error Rate of 10-13 with a binary output format, it is possible for the user to select between the Binary or Gray output data format, in order to reduce the amplitude of such errors when occurring, by storing Gray output codes. Digital Datas format selection: * * BINARY output format if GORB is floating or VCC. GRAY output format if GORB is connected to ground (0V).
Diode Pin 49
One single pin is used for both DRRB input command and die junction monitoring. The pin denomination is DRRB/DIOD. Temperature monitoring and Data Ready control by DRRB is not possible simultaneously. (See "Principle of Data Ready Signal Control by DRRB Input Command" on page 28 for Data Ready Reset input command). The operating die junction temperature must be kept below 145C, therefore an adequate cooling system has to be set up. The diode mounted transistor measured Vbe value versus junction temperature is given below. Figure 40. Diode Pin 49
1000 960 920 880 VBE (mV) 840 800 760 720 680 640 600 -55 -35 -15 5 25 45 65 Junction temperature (C) 85 105 125
ADC Gain Control Pin 60
The ADC gain is adjustable by the means of the pin 60 (input impedance is 1 M in parallel with 2 pF). The gain adjust transfer function is given below.
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Figure 41. ADC Gain Control Pin 60
1.20 1.15 1.10 ADC Gain 1.05 1.00 0.95 0.90 0.85 0.80 -500
-400
-300
-200
-100
0
100
200
300
400
500
Vgain (command voltage) (mV)
Note:
For more information, please refer to the document "DEMUX and ADCs Application Notes".
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Equivalent Input/Output Schematics
Figure 42. Equivalent Analog Input Circuit and ESD Protections
VCC = +5V VCLAMP = +2.4V
-0.8V -0.8V
VCC GND
-5.8V -5.8V
GND = 0V
+1.65V
50 E21V E21V 50
VEE
200 200
VEE VINB
Pad capacitance 340 fF 5.8V
VIN
Pad capacitance 340 fF
-1.55V
5.8V
0.8V
0.8V
E21G
VEE = -5V
E21G
Note:
The ESD protection equivalent capacitance is 150 fF.
Figure 43. Equivalent Analog Clock Input Circuit and ESD Protections
VCC = +5V +0.8V
-5.8V -0.8V
VCC
-5.8V
-5.8V
GND = 0V
-5.8V -5.8V E31V 150 150
VEE CLK
Pad capacitance 340 fF
E31V
VEE CLKB
Pad capacitance 340 fF
5.8V
5.8V
380 A 0.8V 0.8V
E21G
VEE = -5V
E21G
Note:
The ESD protection equivalent capacitance is 150 fF.
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2144C-BDC-04/03
Figure 44. Equivalent Data Output Buffer Circuit and ESD Protections
VPLUSD = 0V to 2.4V
-5.8V
-5.8V
VEE OUT
E01V
E01V
VEE OUTB
5.8V Pad capacitance 180 fF 0.8V
5.8V Pad capacitance 180 fF 0.8V
0.8V
0.8V
VEE = -5V
E21GA
DVEE = -5V VEE = -5V
Note:
The ESD protection equivalent capacitance is 150 fF.
Figure 45. ADC Gain Adjust Equivalent Analog Input Circuit and ESD Protections
VCC = +5V
-0.8V
GND +0.8V
NP1032C2
-5.8V
E22V
GA
Pad capacitance 180 fF
1 k
0.8V
2 pF
0.8V
GND
5.8V 500 A 500 A
VEE
E22GA
VEE = -5V
Note:
The ESD protection equivalent capacitance is 150 fF.
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TS8388B
Figure 46. GORB Equivalent Input Schematic and ESD Protections GORB: Gray or Binary Select Input; Floating or Tied to VCC -> Binary
VCC = +5V
-0.8V 1 k -0.8V 1 k -5.8V 1 k
VEE
E21VA
5 k
GORB
Pad capacitance 180 fF
5.8V
5.8V 250 A 5.8V 250 A
VEE = -5V
E31G
GND = 0V
Note:
The ESD protection equivalent capacitance is 150 fF.
Figure 47. DRRB Equivalent Input Schematic and ESD Protections Actual Protection Range: 6.6V above VEE, in fact stress above GND are clipped by the CB diode used for Tj monitoring
VCC = +5V
GND=0V
NP1032C2 10 k
200
DRRB
-1.3V Pad capacitance 180 fF
-2.6V 5.8V
0.8V
VEE
E21G
VEE = -5V
Note:
The ESD protection equivalent capacitance is 150 fF.
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TSEV8388B: Device Evaluation Board
For complete specification, see separate TSEV8388B document.
General Description
The TSEV8388B Evaluation Board (EB) is a board which has been designed in order to facilitate the evaluation and the characterization of the TS8388B device up to its 1.5 GHz full power bandwidth at up to 1 GSPS in the military temperature range. The high speed of the TS8388B requires careful attention to circuit design and layout to achieve optimal performance. This four metal layer board with internal ground plane has the adequate functions in order to allow a quick and simple evaluation of the TS8388B ADC performances over the temperature range. The TSEV8388B Evaluation Board is very straightforward as it only implements the TS8388B ADC, SMA connectors for input/output accesses and a 2.54 mm pitch connector compatible with high speed acquisition system probes. The board also implements a de-embedding fixture in order to facilitate the evaluation of the high frequency insertion loss of the input microstrip lines, and a die junction temperature measurement setting. The board is constituted by a sandwich of two dielectric layers, featuring low insertion loss and enhanced thermal characteristics for operation in the high frequency domain and extended temperature range. The board dimensions are 130 mm x 130 mm. The board set comes fully assembled and tested, with the TS8388B installed.
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CBGA68 Thermal and Moisture Characteristics
Thermal Resistance from Junction to Ambient: RTHJA The following table lists the converter thermal performance parameters of the device itself, with no external heatsink added. Table 9. Thermal Resitance
Air flow (m/s) 0 0.5 1 1.5 2 2.5 3 4 5 Estimated JA thermal resistance (C/W) 45 35.8 30.8 27.4 24.9 23 21.5 19.3 17.7
Figure 48. Thermal Resistance from Junction to Ambient: RTHJA
50 RTHJA (C/W) 40 30 20 10 0 0 1 2 3 4 5
Air flow (m/s)
Thermal Resistance from Junction to Case: RTHJC
Typical value for Rthjc is given to 6.7C/W (8C/W max). This value does not include thermal contact resistance between package and external component (heatsink or PCBoard). As an example, 2.0C/W can be taken for 50 m of thermal grease.
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CBGA68 Board Assembly with External Heasink
It is recommended to use an external heatsink or PCBoard special design. Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the device. Figure 49. CBGA68 Board Assembly
50.5
24.2
20.2 32.5
31
Board
Moisture Characteristics
This device is sensitive to the moisture (MSL3 according to JEDEC standard): Shelf life in sealed bag: 12 months at <40C and <90% relative humidity (RH). After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temperature 220C) must be: * * mounted within 198 hours at factory conditions of 30C/60% RH, or stored at 20% RH.
Devices require baking, before mounting, if Humidity Indicator Card is >20% when read at 23C 5C. If baking is required, devices may be baked for: * * 192 hours at 40C +5C/-0C and <5% RH for low-temperature device containers, or 24 hours at 125C 5C for high temperature device containers.
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Nominal CQFP68 Thermal Characteristics
Although the power dissipation is low for this performance, the use of a heat sink is mandatory. The user will find some advice on this topics below.
Thermal Resistance from Junction to Ambient: RTHJA
The following table lists the converter thermal performance parameters, with or without heatsink. For the following measurements, a 50 x 50 x 16 mm heatsink has been used (see Figure 51 on page 46). Table 10. Thermal Resitance
ja Thermal Resistance (C/W) CQFP68 on Board Estimated - Without Heatsink 50 40 35 32 30 28 26 24 23.5 Targeted - With Heatsink(1) 10 8.9 7.9 7.3 6.8 6.5 6.2 5.8 5.6
Air Flow (m/s) 0 0.5 1 1.5 2 2.5 3 4 5 Note:
1. Heatsink is glued to backside of package or screwed and pressed with thermal grease.
Figure 50. Thermal Resistance from Junction to Ambient: Rthja
60 50 RTHJA (C/W) 40 30 20 10 0 0 1 2 3 4 5 With heatsink
Without heatsink
Air flow (m/s)
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Thermal Resistance from Junction to Case: RTHJC
Typical value for Rthjc is given to 4.75C/W.
CQFP68 Board Assembly Figure 51. CQFP68 Board Assembly with a 50 x 50 x 16 mm External Heatsink
28.96 24.13 Printed circuit Aluminum heatsink 15.0 Interface: Af-filled epoxy or thermal conductive grease - 100 m max. 2.5 1.4 4.0
16.0
1.3
3.2 50.0
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TS8388B
Enhanced CQFP68 Thermal Characteristics
Enhanced CQFP68 The CQFP68 has been modified, in order to improve the thermal characteristics: * * A CuW heatspreader has been added at the bottom of the package. The die has been electrically isolated with the ALN substrate.
Thermal Resistance from Junction to Case: RTHJC
Typical value for Rthjc is given to 1.56C/W. This value does not include thermal contact resistance between package and external component (heatsink or PCBoard). As an example, 2.0C/W can be taken for 50 m of thermal grease.
Heatsink
It is recommended to use an external heatsink, or PCBoard special design. The stand off has been calculated to permit the simultaneous soldering of the leads and of the heatspreader with the solder paste. Figure 52. Enhanced CQFP68 Suggested Assembly
28.78 24.13 Printed circuit board
CuW heatspreader
Thermal via
Solid ground plane
Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated in the device.
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Definitions
Definition of Terms
(BER) Bit Error Rate Probability to exceed a specified error threshold for a sample. An error code is a code that differs by more than 4 lsb from the correct code. Analog input frequency at which the fundamental component in the digitally reconstructed output has fallen by 3 dB with respect to its low frequency value (determined by FFT analysis) for input at Full Scale. Ratio expressed in dB of the RMS signal amplitude, set to 1 dB below Full Scale, to the RMS sum of all other spectral components, including the harmonics except DC. Ratio expressed in dB of the RMS signal amplitude, set to 1 dB below Full Scale, to the RMS sum of all other spectral components excluding the five first harmonics. Ratio expressed in dBc of the RMS sum of the first five harmonic components, to the RMS value of the measured fundamental spectral component. Ratio expressed in dB of the RMS signal amplitude, set at 1 dB below Full Scale, to the RMS value of the next highest spectral component (peak spurious spectral component). SFDR is the key parameter for selecting a converter to be used in a frequency domain application (Radar systems, digital receiver, network analyzer, etc.). It may be reported in dBc (i.e.: degrades as signal levels is lowered), or in dBFS (i.e.: always related back to converter full scale).
(FPBW) Full Power Input Bandwidth
(SINAD) Signal to Noise and Distortion Ratio (SNR) Signal to Noise Ratio (THD) Total Harmonic Distorsion (SFDR) Spurious Free Dynamic Range
(ENOB) Effective Number Of Bits
ENOB =
SINAD - 1.76 + 20 log (A/V/2) 6.02
Where A is the actual input amplitude and V is the full scale range of the ADC under test. (DNL) Differential Non Linearity The Differential Non Linearity for an output code i is the difference between the measured step size of code i and the ideal LSB step size. DNL (i) is expressed in LSBs. DNL is the maximum value of all DNL (i). DNL error specification of less than 1 lsb guarantees that there are no missing output codes and that the transfer function is monotonic. The Integral Non Linearity for an output code i is the difference between the measured input voltage at which the transition occurs and the ideal value of this transition. INL (i) is expressed in LSBs, and is the maximum value of all |INL (i)|. (DG) Differential Gain The peak gain variation (in percent) at five different DC levels for an AC signal of 20% Full Scale peak to peak amplitude. FIN = 5 MHz (TBC). Peak Phase variation (in degrees) at five different DC levels for an AC signal of 20% Full Scale peak to peak amplitude. FIN = 5 MHz (TBC). Delay between the rising edge of the differential clock inputs (CLK, CLKB) (zero crossing point), and the time at which (VIN, VINB) is sampled.
(INL) Integral Non Linearity
(DP) Differential Phase
(TA) Aperture Delay
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TS8388B
(JITTER) Aperture Uncertainty (TS) Settling Time Sample to sample variation in aperture delay. The voltage error due to jitter depends on the slew rate of the signal at the sampling point. Time delay to achieve 0.2% accuracy at the converter output when a 80% Full Scale step function is applied to the differential analog input. Time to recover 0.2% accuracy at the output, after a 150% full scale step applied on the input is reduced to midscale. Delay from the falling edge of the differential clock inputs (CLK, CLKB) (zero crossing point) to the next point of change in the differential output data (zero crossing) with specified load. Time delay from Data transition to Data ready.
(ORT) Overvoltage Recovery Time (TOD) Digital Data Output Delay (TD1) Time Delay from Data to Data Ready (TD2) Time Delay from Data Ready to Data (TC) Encoding Clock Period (TPD) Pipeline Delay
General expression is TD1 = TC1 + TDR - TOD with TC = TC1 + TC2 = 1 encoding clock period. TC1 = Minimum clock pulse width (high) TC = TC1 + TC2 TC2 = Minimum clock pulse width (low) Number of clock cycles between the sampling edge of an input data and the associated output data being made available, (not taking in account the TOD). For the TS8388B the TPD is 4 clock periods. Delay between the falling edge of the Data Ready output asynchronous Reset signal (DDRB) and the reset to digital zero transition of the Data Ready output signal (DR). Time delay for the output DATA signals to rize from 20% to 80% of delta between low level and high level. Time delay for the output DATA signals to fall from 80% to 20% of delta between low level and high level. Ratio of input offset variation to a change in power supply voltage.
(TRDR) Data Ready Reset Delay (TR) Rise Time
(TF) Fall Time
(PSRR) Power Supply Rejection Ratio (NRZ) Non Return to Zero
When the input signal is larger than the upper bound of the ADC input range, the output code is identical to the maximum code and the Out of Range bit is set to logic one. When the input signal is smaller than the lower bound of the ADC input range, the output code is identical to the minimum code, and the Out of range bit is set to logic one. (It is assumed that the input signal amplitude remains within the absolute maximum ratings). The two tones intermodulation distortion (IMD) rejection is the ratio of either input tone to the worst third order intermodulation products. The input tones levels are at -7 dB Full Scale. The NPR is measured to characterize the ADC performance in response to broad bandwidth signals. When using a notch-filtered broadband white-noise generator as the input to the ADC under test, the Noise Power Ratio is defined as the ratio of the average out-of-notch to the average in-notch power spectral density magnitudes for the FFT spectrum of the ADC output sample test.
(IMD) InterModulation Distortion (NPR) Noise Power Ratio
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Ordering Information
Table 11. Ordering Information
Part Number JTS8388B-1V1B JTS8388B-1V2B TS8388BCF TS8388BVF TS8388BMF TS8388BMF B/Q TS8388BMF B/T TS8388BCFS TS8388BVFS TS8388BMFS TS8388BMFS B/Q TS8388BMFS B/T TS8388BMFS9NB2 Package Die Die CQFP 68 CQFP 68 CQFP 68 CQFP 68 CQFP 68 CQFP 68 with heatspreader CQFP 68 with heatspreader CQFP 68 with heatspreader CQFP 68 with heatspreader CQFP 68 with heatspreader CQFP 68 with heatspreader Temperature Range Ambient Ambient and High temperature (Tj = 125C) C" grade 0C < Tc; Tj < 90C "V" grade -40C < Tc; Tj < 110C "M" grade -55C < Tc; Tj < 125C "M" grade -55C < Tc; Tj < 125C "M" grade -55C < Tc; Tj < 125C "C" grade 0C < Tc; Tj < 90C "V" grade -40C < Tc; Tj < 110C "M" grade -55C < Tc; Tj < 125C "M" grade -55C < Tc; Tj < 125C "M" grade -55C < Tc; Tj < 125C "M" grade -55C < Tc; Tj < 125C Screening Visual inspection Visual inspection Standard Standard Standard Mil-PRF-38535, QML level Q Standard + 3 temperatures test (min, ambient, max) Standard Standard Standard Mil-PRF-38535, QML level Q Standard + 3 temperatures test (min, ambient, max) . ESA/SCC9000 Screening . Non ESA/SCC qualified . Level B selection . Lot Acceptance Test 2 . ESA/SCC9000 Screening . Non ESA/SCC qualified . Level B selection . Lot Acceptance Test 3 . ESA/SCC9000 Screening . Non ESA/SCC qualified . Level C selection . Lot Acceptance Test 2 . ESA/SCC9000 Screening . Non ESA/SCC qualified . Level C selection . Lot Acceptance Test 3 DSCC 5962-0050401QXC DSCC 5962-0050401QYC Comments ON REQUEST ONLY (Please contact Marketing) ON REQUEST ONLY (Please contact Marketing)
TS8388BMFS9NB3
CQFP 68 with heatspreader
"M" grade -55C < Tc; Tj < 125C
TS8388BMFS9NC2
CQFP 68 with heatspreader
"M" grade -55C < Tc; Tj < 125C
TS8388BMFS9NC3
CQFP 68 with heatspreader
"M" grade -55C < Tc; Tj < 125C
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TS8388B
Table 11. Ordering Information
Part Number TS8388BCGL TS8388BVGL TSEV8388BF TSEV8388BFZA2 Package CBGA 68 CBGA 68 CQFP 68 CQFP 68 Temperature Range "C" grade 0C < Tc; Tj < 90C "V" grade -40C < Tc; Tj < 110C Ambient Ambient Screening Standard Standard Prototype Prototype Evaluation board (delivered with heatsink) Evaluation board with digital receivers (delivered with heatsink) Evaluation board (delivered with heatsink) Evaluation board with digital receivers (delivered with heatsink) Comments
TSEV8388BGL TSEV8388BGLZA2
CBGA 68 CBGA 68
Ambient Ambient
Prototype Prototype
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2144C-BDC-04/03
CBGA68 Capacitors and Resistors Implant
Figure 53. TS8388BGL Capacitors and Resistors Implant
GND
0.9 mm
100 pF
7.0 mm
DVEE
0.9 mm
GND
VCC
100 pF
GAIN
GND
100 pF
VINB
GND
50
GND
VIN
50
0.9 mm
VEE
VCC
VEE
CLKB
CLK
100 pF
100 pF
100 pF
50
50
GND
GND
GND
GND
GND
0.9 mm
Only on-package marking Electrically isolated
Note:
R and C are discrete components of 0603 size (1.6 x 0.8 mm).
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GND
VCC
100 pF
GND
VEE
100 pF
GND
VCC
100 pF
GND
VCC
100 pF
GORB
GND
100 pF
TS8388B
Outline Descriptions
Figure 54. Package Dimension - 68 Pins CBGA
CBGA 68 package. AL203 substrate. Package design. Corner balls (x4) are not connected (mechanical ball). Balls : 1.27 mm pitch on 11x11 grid.
0.20 T
Top side with soldered R, C devices
(using solder Sn/Pb 63/37)
-T-
0.95 max Balls side
View balls side
1.27
11 10 9 15.00 0.15 mm 8 7.84 7 6 5 4 3
50
100 pF
Balls Sn/Pb 63/37 AI203 substrate
7.84
AI203 Ceramic Cap. Glued and embedded in substrate
2 1
Ball A1 Index other side 1.00
A
B
C
D
E
F
G
H
J
K
L
-B-
1.45 0.12 15.00 0.15 mm
-A-
D
72x D = 0.80 0.10 mm
0.40 T A B (Position of array of balls / edges A and B) 0.15 T (Position of balls within array)
1.27 ref
Detail of ball x2
0.63 0.10 All units in mm
0.15
53
2144C-BDC-04/03
Outline Dimensions
Figure 55. Package Dimension - 68-lead Ceramic Quad Flat Pack (CQFP)
TOP VIEW
0.8 BCS 20.32 BSC Pin N 1 index 0.050 BCS 1.27 BSC
M 0.005
0.58 0.05 0.023 0.002
24.13 0.152 0.950 0.006 0.005 - 0.010 0.13 - 0.25 1.9 0.20 0.075 0.008
CQFP 68
Y
X
Z
0.950 0.006 24.13 0.152 1.133 - 1.147 28.78 - 29.13
0.004
3.43 Max 0.135 Max
0.46 - 0.88 0.018 - 0.035
0.027 - 0.037 0.70 - 0.95
54
TS8388B
2144C-BDC-04/03
0 - 8
28.78 - 29.13 1.133 - 1.147
TS8388B
Figure 56. Package Dimension - 68-lead Enhanced CQFP with Heatspreder
TOP VIEW
0.8 BCS 20.32 BSC Pin N 1 index 0.050 BCS 1.27 BSC
M 0.005
0.58 0.05 0.023 0.002
24.13 0.152 0.950 0.006 0.978 0.0385 0.005 - 0.010 0.13 - 0.25 0.787 0.0310
CQFP 68
Y
X
Z
0.950 0.006 24.13 0.152 1.133 - 1.147 28.78 - 29.13 0.18 0.13 0.007 0.005
0.51 0.13 0.020 0.005
0.027 - 0.037 0.70 - 0.95
0 - 8
28.78 - 29.13 1.133 - 1.147
55
2144C-BDC-04/03
Datasheet Status Description
Table 12. Datasheet Status
Datasheet Status Objective specification This datasheet contains target and goal specifications for discussion with customer and application validation. This datasheet contains target or goal specifications for product development. This datasheet contains preliminary data. Additional data may be published later; could include simulation results. This datasheet contains also characterization results. This datasheet contains final product specification. Validity Before design phase
Target specification
Valid during the design phase
Preliminary specification -site
Valid before characterization phase
Preliminary specification -site Product specification Limiting Values
Valid before the industrialization phase Valid for production purposes
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application Information Where application information is given, it is advisory and does not form part of the specification.
Life Support Applications
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Atmel customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Atmel for any damages resulting from such improper use or sale.
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2144C-BDC-04/03

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